Model  Part |
DLS-50 | DLS-75 | DLS-100 | DLS-125 | DLS-150 | DLS-175 | DLS-200 | DLS-250 | |
Ring Diameter (mm) |
500 | 750 | 1000 | 1250 | 1500 | 1750 | 2000 | 2500 | |
RotationSpeed (r/min) | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | |
Max. Feeding Particles Size (mm) | -1.0 | -1.0 | -1.3 | -1.3 | -1.3 | -1.3 | -1.3 | -1.3 | |
Suitable Size Distribution | 30%~ 100% = -200 BBS mesh | ||||||||
Slurry Density (%) |
10-40 | 10-40 | 10-40 | 10-40 | 10-40 | 10-40 | 10-40 | 10-40 | |
Slurry Throughput (m3/h) |
0.5-1.0 | 1.0-2.0 | 12.5-20 | 20-50 | 50-100 | 75-150 | 100-200 | 180-450 | |
Feeding CapacitySolid (t/h) |
0.05-0.25 | 0.1-0.5 | 4-7 | 10-18 | 20-30 | 30-50 | 50-80 | 80-150 | |
Rated BG Intensity (Tesla) |
0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | |
Rated Exciting Current (A) |
0-1200 | 0-850 | 0-650 | 0-850 | 0-950 | 0-1200 | 0-1200 | 0-1400 | |
Rated Exciting Voltage (V) |
0-8.3 | 0-13 | 0-26.5 | 0-23 | 0-28 | 0-31 | 0-35 | 0-45 | |
Rated Exciting Power (kw) |
0-10 | 0-11 | 0-17 | 0-19 | 0-27 | 0-37 | 0-43 | 0-63 | |
Ring Motor Power (kw) |
0.37 | 0.55 | 1.1 | 2.2 | 4 | 5.5 | 7.5 | 11 | |
Vibration Motor Power (kw) |
0.55 | 0.75 | 2.2 | 2.2 | 4 | 5.5 | 7.5 | 11 | |
Vibration Stroke (mm) |
0-20 | 0-20 | 0-20 | 0-20 | 0-20 | 0-30 | 0-30 | 0-30 | |
Vibration Frequency (r/min) |
0-300 | 0-300 | 0-300 | 0-300 | 0-300 | 0-300 | 0-300 | 0-300 | |
Water Supply Pressure (MPa) | 0.1-0.2 | 0.1-0.2 | 0.2-0.4 | 0.15-0.3 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | |
Water Consumption (m3/h) |
0.75-1.5 | 5~8 | 10-20 | 30-50 | 60-90 | 80-120 | 100-150 | 200-300 | |
Cooling Water Quantity(m3/h) | 1.5-2 | 1.5-2 | 2-2.5 | 2.5-3 | 3-4 | 4-5 | 5-6 | 6-7 | |
MainBody Weight (t) |
1.5 | 3 | 6 | 14 | 20 | 32 | 48 | 102 | |
Overall dimension (mm) |
Length | 1900 | 2000 | 2800 | 3400 | 3450 | 3900 | 4290 | 5200 |
Width | 1580 | 1360 | 2200 | 2400 | 3050 | 3500 | 3800 | 4850 | |
Height | 1320 | 1680 | 2560 | 2640 | 3150 | 3800 | 4500 | 5560 |
Model  Part |
DLS-50 | DLS-75 | DLS-100 | DLS-125 | DLS-150 | DLS-175 | DLS-200 | DLS-250 | |
Ring Diameter (mm) |
500 | 750 | 1000 | 1250 | 1500 | 1750 | 2000 | 2500 | |
RotationSpeed (r/min) | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | 0-3 | |
Max. Feeding Particles Size (mm) | -1.0 | -1.0 | -1.3 | -1.3 | -1.3 | -1.3 | -1.3 | -1.3 | |
Suitable Size Distribution | 30%~ 100% = -200 BBS mesh | ||||||||
Slurry Density (%) |
10-40 | 10-40 | 10-40 | 10-40 | 10-40 | 10-40 | 10-40 | 10-40 | |
Slurry Throughput (m3/h) |
0.5-1.0 | 1.0-2.0 | 12.5-20 | 20-50 | 50-100 | 75-150 | 100-200 | 180-450 | |
Feeding CapacitySolid (t/h) |
0.05-0.25 | 0.1-0.5 | 4-7 | 10-18 | 20-30 | 30-50 | 50-80 | 80-150 | |
Rated BG Intensity (Tesla) |
0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | 0-1.2 | |
Rated Exciting Current (A) |
0-1200 | 0-850 | 0-650 | 0-850 | 0-950 | 0-1200 | 0-1200 | 0-1400 | |
Rated Exciting Voltage (V) |
0-8.3 | 0-13 | 0-26.5 | 0-23 | 0-28 | 0-31 | 0-35 | 0-45 | |
Rated Exciting Power (kw) |
0-10 | 0-11 | 0-17 | 0-19 | 0-27 | 0-37 | 0-43 | 0-63 | |
Ring Motor Power (kw) |
0.37 | 0.55 | 1.1 | 2.2 | 4 | 5.5 | 7.5 | 11 | |
Vibration Motor Power (kw) |
0.55 | 0.75 | 2.2 | 2.2 | 4 | 5.5 | 7.5 | 11 | |
Vibration Stroke (mm) |
0-20 | 0-20 | 0-20 | 0-20 | 0-20 | 0-30 | 0-30 | 0-30 | |
Vibration Frequency (r/min) |
0-300 | 0-300 | 0-300 | 0-300 | 0-300 | 0-300 | 0-300 | 0-300 | |
Water Supply Pressure (MPa) | 0.1-0.2 | 0.1-0.2 | 0.2-0.4 | 0.15-0.3 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | 0.2-0.4 | |
Water Consumption (m3/h) |
0.75-1.5 | 5~8 | 10-20 | 30-50 | 60-90 | 80-120 | 100-150 | 200-300 | |
Cooling Water Quantity(m3/h) | 1.5-2 | 1.5-2 | 2-2.5 | 2.5-3 | 3-4 | 4-5 | 5-6 | 6-7 | |
MainBody Weight (t) |
1.5 | 3 | 6 | 14 | 20 | 32 | 48 | 102 | |
Overall dimension (mm) |
Length | 1900 | 2000 | 2800 | 3400 | 3450 | 3900 | 4290 | 5200 |
Width | 1580 | 1360 | 2200 | 2400 | 3050 | 3500 | 3800 | 4850 | |
Height | 1320 | 1680 | 2560 | 2640 | 3150 | 3800 | 4500 | 5560 |
Semiconductor/wafer Cleaning Agent
ZSEM produces a variety of high-purity fluorine-containing electronic special gases and organic solvents to make your chip manufacturing easier.Beacause wafer cleaning task is one of the most repeatedly carried out procedure that is undertaken when fabricating wafers. With the ever-changing technology and device shrinking property, cleaning processes do get complicated each time. Wafer contaminants range from particles with a diameter range of 0.1 to 20 microns, organic and inorganic contaminants, and impurities. Wafer cleaning has to be done without introducing any additional impurities or contaminants to the final surface.
Semiconductor Cleaning Agent,Wafer Cleaning Agent,Carbonyl Fluoride Semiconductor Materials,Chemical Special Gas
Shandong Zhongshan Photoelectric Materials Co., Ltd , https://www.zshcchem.com